Atomic layer deposition (ALD) is one of the most advanced deposition techniques in semiconductor or display fields. Owing to the self-limiting reaction of ALD, unusual properties such as large-area uniformity, excellent conformality, and sub-nanometer thickness controllability can be identified.
Thermal Atomic layer etching (tALE), based on thermochemical reaction between the surface and precursors, enables atomic-scale etching. As the device is getting smaller and the structure of the device becomes more complex than before, tALE becomes more and more promising for nanoscale devices without inducing damages.
Organic materials in organic light-emitting diode (OLED) displays are corroded by moistures in air. Thus, a protection layer, referred to as encapsulation, to prevent moisture penetration is necessary. ALD-based encapsulation ensures low defect densities, thereby producing a long-lasting OLED display.
Nanomaterials are more fascinating than Si materials for future electronic materials because they can overcome the previously mentioned limitations. Not only zero-dimensional or one-dimensional structure but also 2D materials have been the focus owing to their distinct properties. Therefore, fabricating and utilizing them is remarkably important.
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